Hsinchu, Taiwan

Heng-Jen Lee

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heng-Jen Lee. Retrieved from https://idiyas.com/inventor/heng-jen-lee-gzmscsfi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

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Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovative Contributions of Heng-Jen Lee in Adaptive Baking Technologies

Introduction

Heng-Jen Lee is a notable inventor based in Hsinchu, Taiwan, renowned for his contributions to semiconductor manufacturing technology. With a keen focus on improving processes in this critical industry, Lee holds a patent that enhances the baking methods used in wafer production. His innovative approach aims to optimize performance and efficiency in semiconductor applications.

Latest Patents

Heng-Jen Lee's significant patent is titled "Adaptive Baking Method." This invention features a sophisticated controller that includes a non-transitory computer-readable medium capable of storing essential data related to the target temperatures of a wafer and heating element. The controller is engineered with a processor that generates heating signals during the baking process, allowing for real-time adjustments based on the temperatures of both the wafer and the heating element. This method ensures precise control over the baking duration, enhancing the quality and reliability of semiconductor fabrication.

Career Highlights

Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited (TSMC), the world's leading semiconductor foundry. Here, he leverages his expertise in technology and innovation to drive advancements in manufacturing processes. His commitment to research and development within TSMC has played a vital role in its status as a frontrunner in the semiconductor industry.

Collaborations

Throughout his career, Heng-Jen Lee has collaborated with distinguished colleagues such as Tzung-Chen Wu and Ho-Yung David Hwang. These partnerships underline the importance of teamwork in the pursuit of technological advancements and the collective effort required to tackle complex challenges in the field of semiconductor manufacturing.

Conclusion

Heng-Jen Lee exemplifies the spirit of innovation essential for progressing technologies in the semiconductor sector. With his patent on adaptive baking methods, he not only contributes to his company but also reinforces the importance of precise engineering in enhancing production efficiency. As technology continues to evolve, inventions like Lee's will remain pivotal in shaping the future of semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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