The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Nov. 16, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tzung-Chen Wu, Hsinchu, TW;

Heng-Jen Lee, Hsinchu, TW;

Ho-Yung David Hwang, Hsinchu, TW;

Wen-Zhan Zhou, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F27D 19/00 (2006.01); F27B 17/00 (2006.01); H01L 21/67 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
F27D 19/00 (2013.01); F27B 17/0025 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/67288 (2013.01); F27D 2019/0003 (2013.01); F27D 2019/0034 (2013.01); F27D 2019/0037 (2013.01); G03F 7/168 (2013.01);
Abstract

A controller includes a non-transitory computer readable medium configured to store information related to a target temperature of a wafer, a target temperature of a heating element, a temperature of the wafer, and a temperature of the heating element. The controller further includes a processor connected to the non-transitory computer readable medium, the processor configured to generate at least one heating signal during a baking process to adjust a duration of an entirety of the baking process in response to the temperature of the wafer and the temperature of the heating element.


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