Heinrich Karrer

Title: **Heinrich Karrer: Innovator in Semiconductor Packaging**

Introduction

Heinrich Karrer, based in Regau, Austria, is a notable inventor recognized for his contributions to the semiconductor packaging industry. With a total of five patents to his name, Karrer has developed innovative techniques that enhance the functionality and efficiency of semiconductor devices.

Latest Patents

Karrer's latest patents showcase his expertise in semiconductor package design and manufacturing processes. One of his key inventions involves a semiconductor package and packaging process for side-wall plating with a conductive film. This innovation presents methods for forming wettable flanks on no-leads semiconductor packages. The design features a lead frame assembly that includes multiple leads, each equipped with a die surface and a plating surface. An integrated circuit die is placed on the die surface, while the plating surface undergoes electrical plating. Following a meticulous singulation process, channels are created by cutting through the leads and electrical plating up to or through the connecting film, thus exposing the lead sidewalls for additional plating.

Another of Karrer's notable patents is focused on package assembly for plating with selective molding. This technique involves the formation of wettable flanks on no-leads semiconductor packages by utilizing a lead frame with plural lead sets. Each lead set contains leads, vias, and an integrated circuit die on the die surface. The method includes using a mold chase applied to the plating surfaces, which partially embeds the lead frame assembly in mold encapsulation. This innovative approach allows for meticulous exposure and plating of the vias and plating surfaces.

Career Highlights

Throughout his career, Heinrich Karrer has worked with reputable companies in the semiconductor sector, including Vishay General Semiconductor, Inc. and Vishay Semiconductor GmbH. His deep expertise and inventive spirit have solidified his reputation as a leading figure in semiconductor technology.

Collaborations

Karrer has collaborated with talented colleagues such as Longnan Jin and Junfeng Liu. These partnerships have facilitated the exchange of ideas and expertise, fostering advancements in the field of semiconductor packaging.

Conclusion

Heinrich Karrer's innovative contributions to semiconductor packaging have significantly impacted the industry. His patents not only exhibit a deep understanding of technology but also underscore the importance of collaboration and creativity in driving advancements. His work continues to inspire future innovations in semiconductor design and manufacturing.