The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Jun. 19, 2008
Applicant:
Heinrich Karrer, Regau, AT;
Inventor:
Heinrich Karrer, Regau, AT;
Assignee:
Vishay Semiconductor GmbH, Heilbronn, DE;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01G 2/06 (2006.01); H01L 23/50 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01G 2/065 (2013.01); H01L 23/49805 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H05K 3/3442 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/10636 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A surface-mountable electronic device free of leads has a plurality of solderable connection surfaces at its lower side, with at least one of the connection surfaces having a rectangular portion. The outline of this rectangular portion corresponds to a connection surface of the JEDEC Standard MO-236 or of any other standard according to which the respective connection surface should not extend directly up to a side edge of the lower device side. The at least one connection surface furthermore has an extension section which extends, starting from the rectangular portion, in the direction of a side edge of the lower side of the device.