Munich, Germany

Heinrich Hennhofer

This inventor holds 2 USPTO granted patents. Top assignee: Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag. Active years: 1999-2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heinrich Hennhofer. Retrieved from https://idiyas.com/inventor/heinrich-hennhofer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.9

ph-index = 2

Forward Citations = 40(Granted Patents)


Location History:

  • Altotting, DE (1999)
  • Alotting, DE (2000)

Company Filing History:


Years Active: 1999-2000

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2 patents (USPTO):Explore Patents

Title: Heinrich Hennhofer: Innovator in Semiconductor Polishing Technology

Introduction

Heinrich Hennhofer is a notable inventor based in Munich, Germany. He has made significant contributions to the field of semiconductor technology, particularly in the polishing processes of semiconductor wafers. With a total of 2 patents, Hennhofer's work has advanced the efficiency and effectiveness of semiconductor manufacturing.

Latest Patents

Hennhofer's latest patents include a "Process and device for polishing semiconductor wafers." This innovation involves a method where at least one side of a semiconductor wafer is pressed against a polishing plate, over which a polishing cloth is stretched. The semiconductor wafer and the polishing plate are moved relative to each other to achieve the desired polish. During this process, the wafer passes over at least two regions on the polishing plate, which have defined radial widths and are maintained at different temperatures. Temperature-control means are integrated into the polishing plate, allowing for precise adjustments before the polishing begins.

Another significant patent is the "Method and device for polishing semiconductor wafers." This method involves mounting semiconductor wafers on the front side of a support plate, with one side pressed against a polishing plate covered with a polishing cloth. The method includes applying specific pressure to multiple pressure chambers prior to polishing, ensuring optimal results during the process.

Career Highlights

Heinrich Hennhofer is currently associated with Wacker Siltronic Gesellschaft für Halbleitermaterialien AG, a leading company in the semiconductor industry. His work at Wacker Siltronic has positioned him as a key player in the development of advanced semiconductor polishing technologies.

Collaborations

Hennhofer has collaborated with notable colleagues such as Manfred Thurner and Thomas Buschhardt. Their combined expertise has contributed to the successful development of innovative solutions in semiconductor processing.

Conclusion

Heinrich Hennhofer's contributions to semiconductor polishing technology reflect his dedication to innovation and excellence in the field. His patents and work at Wacker Siltronic continue to influence the semiconductor industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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