The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1999
Filed:
Dec. 09, 1997
Paul Muller, Ostermiething, AT;
Thomas Buschhardt, Burghausen, DE;
Heinrich Hennhofer, Altotting, DE;
Norbert Sickmann, Burghausen, DE;
Rainer Neumann, Kirchdorf, DE;
Franz Mangs, Tittmoning, DE;
Manfred Thurner, Ach, AT;
Klaus Rottger, Schnaitsee, DE;
Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG, Burghausen, DE;
Abstract
A method is for the polishing of semiconductor wafers, which are mounted on a front side of a support plate and one side face of which is pressed anst a polishing plate, which is covered with a polishing cloth, with a specific polishing pressure and polished. A device is provided which is suitable for carrying out the method. The method includes a) applying a specific pressure to at least one of a plurality of pressure chambers prior to the polishing of the semiconductor wafers, and b) during the polishing of the semiconductor wafers, transmitting the polishing pressure to a rear side of the support plate via elastic bearing surfaces of the pressure chambers to which pressure has been applied.