Suwon-si, South Korea

Hee-jung Hwang

USPTO Granted Patents = 7 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2014-2019

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7 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Hee-jung Hwang

Introduction

Hee-jung Hwang is a prominent inventor based in Suwon-si, South Korea, recognized for his contributions to the field of semiconductor technology. With a total of seven patents to his name, Hwang has significantly advanced the development of innovative electronic packaging solutions.

Latest Patents

His latest patents reflect his expertise and ingenuity in creating sophisticated semiconductor packages. One notable invention is the **Film Type Semiconductor Package**, which includes a film substrate featuring a metal pattern that extends in one direction and incorporates multiple through holes. This design enhances the efficiency and functionality of semiconductor chips, allowing for better integration of multiple pads and bumps, thus optimizing the chip's performance.

Another significant patent is the **Package Substrate and Semiconductor Package Including the Same**. This invention consists of an insulating substrate that allows for the mounting of semiconductor chips while including a warpage-suppressing member. By minimizing substrate warpage during the reflow process, this innovation ensures the reliability and durability of semiconductor packages, making it a vital advancement in the industry.

Career Highlights

Hee-jung Hwang is an accomplished inventor associated with Samsung Electronics Co., Ltd., a global leader in technology and electronics. His work at Samsung has positioned him at the forefront of semiconductor innovations, playing a crucial role in the development of cutting-edge packaging solutions that meet the demands of modern technology.

Collaborations

Throughout his career, Hwang has collaborated with esteemed colleagues such as Mi-Na Choi and Ji-Chul Kim. These partnerships have contributed to a collaborative environment that fosters creativity and the exchange of ideas, further driving innovation in semiconductor technology.

Conclusion

Hee-jung Hwang’s contributions to the field of semiconductor packaging exemplify the importance of innovation in technology. With his impressive portfolio of patents, Hwang continues to influence the electronic industry, ensuring the advancement of more efficient and reliable semiconductor solutions. As technology evolves, his work will undoubtedly remain pivotal in shaping the future of electronic devices.

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