The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Aug. 29, 2012
Ji-chul Kim, Yongin-si, KR;
Jin-kwon Bae, Hwaseong-si, KR;
Mi-na Choi, Seoul, KR;
Hee-jung Hwang, Suwon-si, KR;
Ji-Chul Kim, Yongin-si, KR;
Jin-Kwon Bae, Hwaseong-si, KR;
Mi-Na Choi, Seoul, KR;
Hee-Jung Hwang, Suwon-si, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.