Location History:
- Hwasung, KR (2017)
- Hwaseong-si, KR (2012 - 2020)
Company Filing History:
Years Active: 2012-2020
Title: Jin-Kwon Bae: Innovator in Semiconductor Technology
Introduction
Jin-Kwon Bae is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on innovative methods for thermal management and semiconductor packaging.
Latest Patents
One of his latest patents is titled "Thermoelectric cooling packages and thermal management methods thereof." This invention outlines a method for managing the temperature of a device by determining the temperature of a circuit or package and selectively operating a thermoelectric semiconductor to adjust the temperature accordingly. Another notable patent is "Semiconductor package and semiconductor device including the same." This patent describes a semiconductor device that features a substrate, a first semiconductor package, and a second semiconductor package. The second package includes a semiconductor chip stacked on the substrate, with a heat-blocking structure that prevents heat generated from the first package from affecting the second.
Career Highlights
Jin-Kwon Bae is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing thermal management technologies, which are crucial for the performance and reliability of electronic devices.
Collaborations
Throughout his career, Jin-Kwon has collaborated with talented individuals such as Jichul Kim and Jae Choon Kim. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the semiconductor field.
Conclusion
Jin-Kwon Bae is a key figure in semiconductor innovation, with a strong portfolio of patents that reflect his expertise and dedication to advancing technology. His contributions continue to shape the future of thermal management and semiconductor packaging.