The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

May. 29, 2014
Applicants:

Eon Soo Jang, Suwon-si, KR;

Kyol Park, Daejeon, KR;

Jongwoo Park, Seongnam-si, KR;

Jin-kwon Bae, Hwaseong-si, KR;

Yunhyeok Im, Hwaseong-si, KR;

Jichul Kim, Yongin-si, KR;

Soojae Park, Seongnam-si, KR;

Inventors:

Eon Soo Jang, Suwon-si, KR;

Kyol Park, Daejeon, KR;

Jongwoo Park, Seongnam-si, KR;

Jin-Kwon Bae, Hwaseong-si, KR;

Yunhyeok Im, Hwaseong-si, KR;

Jichul Kim, Yongin-si, KR;

Soojae Park, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/433 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/36 (2013.01); H01L 25/0652 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/4334 (2013.01); H01L 24/73 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract

According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.


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