The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Jun. 13, 2011
Jae-wook Yoo, Suwon-si, KR;
Kyoung-sei Choi, Yongin-si, KR;
Eun-seok Cho, Suwon-si, KR;
Mi-na Choi, Seoul, KR;
Hee-jung Hwang, Suwon-si, KR;
Se-ran Bae, Yongin-so, KR;
Jae-Wook Yoo, Suwon-si, KR;
Kyoung-Sei Choi, Yongin-si, KR;
Eun-Seok Cho, Suwon-si, KR;
Mi-Na Choi, Seoul, KR;
Hee-Jung Hwang, Suwon-si, KR;
Se-Ran Bae, Yongin-so, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A heat sink includes a first adhesive layer, and a heat dissipation layer disposed on the first adhesive layer, and has ventilation ports that extend therethrough including through the first adhesive layer and the heat dissipation layer. The heat sink forms an outermost part of a semiconductor package. Thus, when the heat sink is bonded via its adhesive layer to underlying structure during a manufacturing process, the ventilation ports allow air to pass therethrough. As a result, air is not trapped in the form of bubbles between the heat sink and the underlying structure.