Hee-Guk Choi

Title: Hee-Guk Choi: Innovator in Semiconductor Technology

Introduction

Hee-Guk Choi is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the manufacturing processes of chip scale packages and solder ball formation.

Latest Patents

Hee-Guk Choi holds 2 patents that showcase his innovative approaches. His first patent is a method of forming a solder ball on a board. In this method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of the thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad, which may be made of copper. His second patent is for a method for manufacturing a chip scale package that includes slits formed on a substrate. This method involves providing a flexible substrate with a conductive pattern, forming a first photosensitive resin pattern over the top surface, curing it, and then forming a second photosensitive resin pattern that includes a slit. This innovation addresses issues such as the burning of neighboring patterns and the overflow of encapsulants.

Career Highlights

Hee-Guk Choi is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in enhancing the efficiency and reliability of electronic components.

Collaborations

Hee-Guk Choi collaborates with talented individuals in his field, including Seung-Woo Kim and Pyeong-Wan Kim. Their combined expertise contributes to the advancement of innovative solutions in semiconductor manufacturing.

Conclusion

Hee-Guk Choi's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His inventions are paving the way for future advancements in electronic components.