The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Aug. 04, 2005
Applicants:
Seung-woo Kim, Asan, KR;
Pyeong-wan Kim, Cheonan, KR;
Sang-ho Ahn, Suwon, KR;
Bo-seong Kim, Seoul, KR;
Ho-jeong Mun, Cheonan, KR;
Tae-seong Park, Cheonan, KR;
Hee-guk Choi, Seoul, KR;
Inventors:
Seung-Woo Kim, Asan, KR;
Pyeong-Wan Kim, Cheonan, KR;
Sang-Ho Ahn, Suwon, KR;
Bo-Seong Kim, Seoul, KR;
Ho-Jeong Mun, Cheonan, KR;
Tae-Seong Park, Cheonan, KR;
Hee-Guk Choi, Seoul, KR;
Assignee:
Samsung Electronics, Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 7/06 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.