This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2007.
Company Filing History:
Years Active: 2007
Title: Ho-Jeong Mun: Innovator in Solder Ball Technology
Introduction
Ho-Jeong Mun is a notable inventor based in Cheonan, South Korea. He has made significant contributions to the field of electronics through his innovative patent. His work primarily focuses on methods that enhance the manufacturing processes in electronic components.
Latest Patents
Ho-Jeong Mun holds a patent for a "Method of forming a solder ball on a board." This method involves etching a conductive pad of the board to a depth greater than 50% and less than 100% of the thickness of the conductive pad. Following this process, a solder ball can be formed on the etched conductive pad, which may consist of materials such as copper. This innovation is crucial for improving the reliability and efficiency of electronic assemblies.
Career Highlights
Ho-Jeong Mun is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His role at Samsung allows him to work on cutting-edge technologies and contribute to the advancement of electronic manufacturing processes. His expertise in solder ball technology is a testament to his skills and knowledge in the field.
Collaborations
Throughout his career, Ho-Jeong Mun has collaborated with talented individuals such as Hee-Guk Choi and Pyeong-Wan Kim. These collaborations have fostered an environment of innovation and creativity, leading to advancements in their respective projects.
Conclusion
Ho-Jeong Mun's contributions to solder ball technology exemplify his dedication to innovation in the electronics industry. His patent and work at Samsung Electronics Co., Ltd. highlight his role as a key inventor in this field.