Samsung Electronics Co., Ltd.

Hee-Guk Choi

Shin Hyoung Kim

Se Yong Oh

Bo-Seong Kim

Sang-Ho Ahn

Seung-Woo Kim

Tae-Seong Park

Se Ill Kim

Pyeong-Wan Kim

Ho-Jeong Mun

In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.

Method of forming a solder ball on a board and the board

A method for manufacturing a chip scale package (CSP) including a semiconductor chip and conductive bumps is disclosed. In the present invention, a flexible substrate is provided with a conductive pattern formed thereon. The substrate has a top surface and a bottom surface. Then, a first photosensitive resin pattern is formed over the top surface of the substrate. Next, the first photosensitive resin pattern is cured. Subsequently, a second photosensitive resin pattern is formed over the cured first photosensitive resin pattern. The second photosensitive resin pattern includes a slit comprising a bottom of the first photosensitive resin pattern and side walls of the second photosensitive resin pattern. With the present invention, the problem of burning of neighboring patterns as well as the problem of the overflow of the encapsulant can be overcome.

Method for manufacturing a chip scale package having slits formed on a substrate

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Seoul, South Korea

Hee-Guk Choi