Location History:
- Seoul, KR (2012)
- Gunpo-si, KR (2011 - 2013)
Company Filing History:
Years Active: 2011-2013
Title: Hee-Bum Shin: Innovator in Printed Circuit Board Technology
Introduction
Hee-Bum Shin is a notable inventor based in Gunpo-si, South Korea. He has made significant contributions to the field of printed circuit board technology, holding a total of 3 patents. His work focuses on improving the manufacturing processes and reliability of printed circuit boards.
Latest Patents
One of his latest patents is titled "Printed circuit board using bump and method for manufacturing thereof." This invention provides a method for manufacturing a printed circuit board where through holes of a core board are filled by reverse pulse plating. This advancement allows for the creation of a core board with a thickness greater than 100 µm, overcoming previous processing limitations. The invention also forms bumps on a thick insulation layer, enhancing the strength of the core board and improving the convenience of joining layers. Additionally, it offers excellent heat-releasing effects and enables the collective stacking of core boards, which was not feasible with conventional methods.
Another significant patent is the "Method of manufacturing a printed circuit board." This patent describes a printed circuit board that includes a first insulation layer and a second insulation layer stacked over it. The circuit pattern and a via land are buried in the second insulation layer, with a via made of a conductive material penetrating the first insulation layer. This integrated structure increases electrical reliability and simplifies the manufacturing process, leading to greater productivity.
Career Highlights
Hee-Bum Shin is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in the field of electronics. His work has been instrumental in advancing the technology behind printed circuit boards, making them more efficient and reliable.
Collaborations
Hee-Bum has collaborated with notable coworkers, including Jee-Soo Mok and Dong-Jin Park, contributing to the development of cutting-edge technologies in their field.
Conclusion
Hee-Bum Shin's contributions to printed circuit board technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in the industry and provide solutions that enhance manufacturing processes and product reliability.