The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Aug. 22, 2008
Hee-bum Shin, Seoul, KR;
Jeong-ho Moon, Suwon-si, KR;
Jae-hyun Eom, Gyeongsangbuk-do, KR;
Jee-soo Mok, Yongin-si, KR;
Hee-Bum Shin, Seoul, KR;
Jeong-Ho Moon, Suwon-si, KR;
Jae-Hyun Eom, Gyeongsangbuk-do, KR;
Jee-Soo Mok, Yongin-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include a first insulation layer, a second insulation layer stacked over the first insulation layer, a circuit pattern and a via land buried in the second insulation layer, and a via made of a conductive material penetrating the first insulation layer and integrated with the via land. The circuit pattern and via land can be buried in the insulation material, and the circuit pattern, via land, and via can be formed simultaneously as an integrated structure. Thus, the electrical reliability between the wiring pattern and the via can be increased, the heat-releasing effect of the via can be improved, and the procedure for forming the circuit patterns, via lands, and vias can be simplified, allowing greater productivity in manufacturing the substrate.