The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
Mar. 28, 2007
Hee-bum Shin, Gunpo-si, KR;
Dong-jin Park, Suwon-si, KR;
Jee-soo Mok, Yongin-si, KR;
Jong-suk Bae, Busan, KR;
Ki-hwan Kim, Boryeong-si, KR;
Hee-Bum Shin, Gunpo-si, KR;
Dong-Jin Park, Suwon-si, KR;
Jee-Soo Mok, Yongin-si, KR;
Jong-Suk Bae, Busan, KR;
Ki-Hwan Kim, Boryeong-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
The present invention provides a method for manufacturing a printed circuit board and a print circuit board manufactured thereby, in which through holes of a core board are filled by reverse pulse plating so that it allows to manufacture a core board having greater than 100 μm of a thickness which has been a processing limitation with conventional technologies and form bumps on a thick insulation layer, which has been difficult till now, and thus providing resistance against pressure of paste bumps produced during stacking due to the increased strength of a core board, convenience to join between layers, excellent heat-releasing effect, and collectively stacking of core boards, which was not possible with conventional methods.