This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Intel Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hazwani Jaffar: Inventor of a Molded Interconnect Memory-on-Package Design.
Introduction
Hazwani Jaffar is an inventor based in Kepala Batas, Malaysia, and is associated with Intel Corporation. His patent work includes an electronic packaging design that integrates memory with a processor system.
Latest Patents
Jaffar is credited with 1 patent: “Molded interconnect memory on package.” The invention describes an electronic system with a processor integrated circuit mounted on a first substrate and a companion component built on a second substrate. Differently positioned solder bumps connect the companion component to the first substrate, with the arrangement aligning selected bump surfaces at specified heights. The design addresses how components can be interconnected within a compact electronic package.
Career Highlights
Jaffar’s listed patent reflects work in semiconductor packaging and electronic system integration. His association with Intel Corporation places this invention within the broader field of processor and memory technologies.
Collaborations
Poh Boon Khoo and Hooi San Lam are identified as Jaffar’s coworkers. The available information does not specify their roles in the patent or whether they collaborated on this invention.
Conclusion
Hazwani Jaffar’s patent documents a packaging approach for connecting a processor and companion component through carefully arranged solder bumps, highlighting his contribution to electronic system integration.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile