Toyama, Japan

Harunobu Sakuma

This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignee: Hitachi-Kokusai Electric Inc.. Active years: 2005-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Harunobu Sakuma. Retrieved from https://idiyas.com/inventor/harunobu-sakuma

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 200(Granted Patents)


Location History:

  • Tokyo, JP (2005)
  • Toyama, JP (2011 - 2017)

Company Filing History:


Years Active: 2005-2017

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5 patents (USPTO):Explore Patents

Title: Harunobu Sakuma: Innovator in Semiconductor Technology

Introduction

Harunobu Sakuma is a prominent inventor based in Toyama, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on developing advanced apparatuses and methods for processing substrates and manufacturing semiconductor devices.

Latest Patents

Sakuma's latest patents include a substrate processing apparatus and a method of manufacturing semiconductor devices. The substrate processing apparatus is designed to accommodate multiple substrates and utilizes a reaction tube that is supplied with gas generated from a solution containing a reactant. This innovative design features a lid that closes the reaction tube, a first heater for heating the substrates, and a thermal conductor placed on the lid. Additionally, a second heater is positioned outside the reaction tube to heat the gas flowing near the lid, while a heating element on the lower surface of the lid further enhances the heating process.

Another notable patent involves an apparatus for manufacturing semiconductor devices, which includes a processing liquid supply part, a heater part for heating the processing liquid, and a substrate support part within the processing chamber. These inventions reflect Sakuma's commitment to advancing semiconductor manufacturing technologies.

Career Highlights

Harunobu Sakuma is currently employed at Hitachi Kokusai Electric Inc., where he continues to innovate in the semiconductor field. His work has been instrumental in improving the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Sakuma has collaborated with notable colleagues, including Yuichi Wada and Hiroshi Ashihara. Their combined expertise has contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Harunobu Sakuma's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in manufacturing processes, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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