The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
May. 21, 2014
Applicant:
Hitachi Kokusai Electric Inc., Tokyo, JP;
Inventors:
Yuichi Wada, Toyama, JP;
Harunobu Sakuma, Toyama, JP;
Hiroshi Ashihara, Toyama, JP;
Hideto Tateno, Toyama, JP;
Assignee:
Hitachi Kokusai Electric, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67017 (2013.01); C23C 16/4584 (2013.01); C23C 16/45578 (2013.01); H01L 21/0262 (2013.01); H01L 21/02238 (2013.01);
Abstract
An apparatus for manufacturing semiconductor devices is provided with a processing liquid supply part for supplying processing liquid into a processing chamber which houses a substrate, a heater part for heating the processing liquid in the processing chamber, and a substrate support part which is provided in the processing chamber and supports the substrate.