This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Harsha Vardhan Penugonda: Innovator in Multi-Chip Interposer Technology
Introduction
Harsha Vardhan Penugonda is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of multi-chip interposers. His innovative work has led to the development of a unique patent that enhances the efficiency and functionality of interconnection structures.
Latest Patents
Harsha Vardhan Penugonda holds a patent titled "Interconnection structure for multi-chip interposer and method of manufacturing same." This patent describes an interconnection structure that includes a first via stack at a designated location, with the stack comprising vias arranged in a third direction that is perpendicular to the first and second directions. The invention also features a transition segment in a transition layer that is conductive and extends to overlap another location, along with a first contact bump at the second location that is coupled to the via stack. This innovative design aims to improve the performance and reliability of multi-chip interposer systems.
Career Highlights
Harsha Vardhan Penugonda is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role at the company allows him to apply his expertise in semiconductor technology and contribute to cutting-edge innovations in the field.
Collaborations
Due to space constraints, the collaborations section has been omitted.
Conclusion
Harsha Vardhan Penugonda is a prominent inventor whose work in multi-chip interposer technology has the potential to significantly impact the semiconductor industry. His patent reflects a deep understanding of interconnection structures and showcases his innovative spirit.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile