Company Filing History:
Years Active: 2007-2020
Title: Harold Anderson: Innovator in Wire Bonding Systems
Introduction
Harold Anderson is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of wire bonding systems, holding a total of 6 patents. His work has advanced the technology used in semiconductor manufacturing.
Latest Patents
Among his latest patents is a wire bonding system that includes a bond wire made of copper (Cu) and a bond pad made of aluminum (Al). This innovative system features a sacrificial anode that is electrically coupled with the bond pad. The sacrificial anode comprises one or more elements that have a standard electrode potential below that of aluminum. This design enhances the reliability and efficiency of wire bonding processes.
Career Highlights
Harold has worked with Semiconductor Components Industries, LLC, where he applied his expertise in developing advanced semiconductor technologies. His contributions have been instrumental in improving the performance and durability of electronic components.
Collaborations
Throughout his career, Harold has collaborated with talented individuals such as Cang Ngo and James H. Knapp. These partnerships have fostered innovation and have led to the successful development of various technologies in the semiconductor industry.
Conclusion
Harold Anderson's work in wire bonding systems exemplifies his commitment to innovation in the semiconductor field. His patents and collaborations have significantly impacted the industry, showcasing his role as a leading inventor.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.