The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2008
Filed:
Nov. 18, 2005
Applicants:
Harold G. Anderson, Chandler, AZ (US);
Cang Ngo, Mesa, AZ (US);
Yong LI Xu, Phoenix, AZ (US);
James Mohr, Gilbert, AZ (US);
Inventors:
Harold G. Anderson, Chandler, AZ (US);
Cang Ngo, Mesa, AZ (US);
Yong Li Xu, Phoenix, AZ (US);
James Mohr, Gilbert, AZ (US);
Assignee:
Semiconductor Components Industries, L.L.C., Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
In one embodiment, a semiconductor package is formed by adding a layer of particles to desired portions of a packing substrate. The layer of particles forms a matrix of crevices that provides a micro-lock feature for mechanically locking or engaging encapsulating materials.
Anderson, Harold. (2008). Semiconductor package structure and method of manufacture (U.S. Patent No. 7382059). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7382059
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile