The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2007

Filed:

Sep. 10, 2002
Applicants:

James Knapp, Gilbert, AZ (US);

Francis Carney, Gilbert, AZ (US);

Harold Anderson, Chandler, AZ (US);

Yenting Wen, Chandler, AZ (US);

Cang Ngo, Mesa, AZ (US);

Inventors:

James Knapp, Gilbert, AZ (US);

Francis Carney, Gilbert, AZ (US);

Harold Anderson, Chandler, AZ (US);

Yenting Wen, Chandler, AZ (US);

Cang Ngo, Mesa, AZ (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/64 (2006.01); H01L 23/48 (2006.01); H01L 23/58 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device () includes a semiconductor die () and an inductor () formed with a bonding wire () attached to a top surface () of the semiconductor die. The bonding wire is extended laterally a distance (L, L) greater than its height (H, H) to define an insulating core (). In one embodiment, the inductor is extended beyond an edge () of the semiconductor die to reduce loading.


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