Semiconductor Components Industries, LLC

Harold Anderson

Cang Ngo

Gordon M Grivna

James H Knapp

George Chang

Wentao Qin

Thomas Anderson

Francis J Carney

Jay A Yoder

Yenting Wen

Yong Li Xu

James Mohr

A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically coupled with the bond pad, where the sacrificial anode includes one or more elements having a standard electrode potential below a standard electrode potential of Al.

Wire bonding systems and related methods

A process of forming an electronic device includes providing a wire comprising a first ball at an end thereof, operating on the first ball to modify a surface of the first ball to form a modified surface, moving the first ball to a first location on a die, and bonding the first ball along the modified surface to the first location of the die. In an embodiment, the process further includes moving a bonding tool including the wire away from the die while the wire remains bonded to the die.

Process of forming an electronic device including a ball bond

A semiconductor device () is made by mounting the bottom surfaces () of a semiconductor die () and a lead () on a tape () and over a hole () in the tape. A vacuum is drawn through the hole to secure the die in place when the lead's top surface () is wirebonded to a top surface () of the semiconductor die. A molding material () is formed to encapsulate the top surface of the semiconductor die and to expose its bottom surface.

Method of marking a low profile packaged semiconductor device

In one embodiment, a semiconductor package is formed by adding a layer of particles to desired portions of a packing substrate. The layer of particles forms a matrix of crevices that provides a micro-lock feature for mechanically locking or engaging encapsulating materials.

Semiconductor package structure and method of manufacture

A semiconductor device () includes a semiconductor die () and an inductor () formed with a bonding wire () attached to a top surface () of the semiconductor die. The bonding wire is extended laterally a distance (L, L) greater than its height (H, H) to define an insulating core (). In one embodiment, the inductor is extended beyond an edge () of the semiconductor die to reduce loading.

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Chandler, AZ, United States of America

Harold Anderson