Harlan R Isaak

Title: Harlan R. Isaak: Innovator in Three-Dimensional Module Technology

Introduction

Harlan R. Isaak is a prominent inventor based in Costa Mesa, California, known for his significant contributions to the field of integrated circuit technology. With a total of 17 patents to his name, Isaak has made a lasting impact on the development of advanced electronic components.

Latest Patents

One of Isaak's latest patents focuses on the panel stacking of BGA (Ball Grid Array) devices to form three-dimensional modules. This innovative chip stack comprises at least one base layer that includes a base substrate with a first conductive pattern. The design also features an interconnect frame with a second conductive pattern that is electrically connected to the first conductive pattern of the base layer. The chip stack incorporates at least two integrated circuit chip packages, which can be connected to the first conductive pattern in various configurations. Additionally, a transposer layer may be included, featuring a third conductive pattern specifically designed to provide a CSP-TSOP interface.

Career Highlights

Throughout his career, Harlan R. Isaak has worked with various companies, including Dense-Pac Microsystems, Inc. His expertise in the field has allowed him to develop cutting-edge technologies that enhance the performance and efficiency of electronic devices.

Collaborations

Isaak has collaborated with notable professionals in the industry, including John A. Forthun and Andrew C. Ross. These partnerships have contributed to the advancement of innovative solutions in integrated circuit technology.

Conclusion

Harlan R. Isaak's work in the field of three-dimensional module technology exemplifies his dedication to innovation and excellence. His patents and collaborations continue to influence the landscape of electronic components, showcasing his role as a key figure in the industry.