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Forward Citations = 1,150

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9 inventors (with patents filed for the assignee):

Harlan R Isaak (4 out of 17 patents)

John A Forthun (3 out of 8 patents)

Floyd K Eide (3 out of 9 patents)

4. Andrew C Ross (1 out of 8 patents)

5. Ted Bruce (1 out of 2 patents)

6. John Patrick Sprint (1 out of 2 patents)

7. Joel Andrew Mearig (1 out of 2 patents)

8. Mark Chandler Calkins (1 out of 1 patent)

9. Aaron Uri Levy (1 out of 1 patent)

8 patents: Sort by Forward Citations

1. 6627984 - Chip stack with differing chip package types (2003-09-30),

2. 6404043 - Panel stacking of BGA devices to form three-dimensional modules (2002-06-11),

3. 6323060 - Stackable flex circuit IC package and method of making same (2001-11-27),

4. 6222737 - Universal package and method of forming the same (2001-04-24),

5. 5869353 - Modular panel stacking process (1999-02-09),

6. 5612570 - Chip stack and method of making same (1997-03-18),

7. 5313096 - IC chip package having chip attached to and wire bonded within an (1994-05-17),

8. 4956694 - Integrated circuit chip stacking (1990-09-11),

Dense-pac Microsystems, Inc. is a leading provider of high-density interconnect solutions for various industries including aerospace, defense, and telecommunications. With a focus on innovation and quality, Dense-pac offers a wide range of products and services to meet the evolving needs of its customers.

Profile summary based on public USPTO records.