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Forward Citations = 1,148

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9 inventors (with patents filed for the assignee):

Harlan R Isaak (4 out of 17 patents)

John A Forthun (3 out of 8 patents)

Floyd K Eide (3 out of 9 patents)

4. Andrew C Ross (1 out of 8 patents)

5. Ted Bruce (1 out of 2 patents)

6. John Patrick Sprint (1 out of 2 patents)

7. Joel Andrew Mearig (1 out of 2 patents)

8. Mark Chandler Calkins (1 out of 1 patent)

9. Aaron Uri Levy (1 out of 1 patent)

8 patents: Sort by Forward Citations

1. 6627984 - Chip stack with differing chip package types (2003-09-30),

2. 6404043 - Panel stacking of BGA devices to form three-dimensional modules (2002-06-11),

3. 6323060 - Stackable flex circuit IC package and method of making same (2001-11-27),

4. 6222737 - Universal package and method of forming the same (2001-04-24),

5. 5869353 - Modular panel stacking process (1999-02-09),

6. 5612570 - Chip stack and method of making same (1997-03-18),

7. 5313096 - IC chip package having chip attached to and wire bonded within an (1994-05-17),

8. 4956694 - Integrated circuit chip stacking (1990-09-11),

Dense-pac Microsystems, Inc. is a leading provider of high-density interconnect solutions for various industries including aerospace, defense, and telecommunications. With a focus on innovation and quality, Dense-pac offers a wide range of products and services to meet the evolving needs of its customers.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

8 Patents

#12 in Garden Grove, CA

#8,277 in California

#34,852 in US

Garden Grove, CA, United States of America

Dense-pac Microsystems, Inc.