The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 1997
Filed:
Apr. 13, 1995
Floyd K Eide, Huntington Beach, CA (US);
John A Forthun, Glendora, CA (US);
Harlan Isaak, Costa Mesa, CA (US);
Dense-Pac Microsystems, Inc., Garden Grove, CA (US);
Abstract
An integrated circuit chip stack includes a stack of chip packages mounted on a substrate. Each chip package includes a plastic packaged chip mounted within a central aperture in a thin, planar frame by soldering leads at opposite ends of the plastic package to conductive pads on an upper surface of the frame adjacent the central aperture. Conductive traces and vias couple the conductive pads to other conductive pads on upper and lower surfaces of the frame adjacent outer edges thereof. The conductive pads adjacent the outer edges are soldered to the conductive pads of adjacent chip packages by dipping the edges of an assembled stack of the chip packages in solder. The chip stack thus formed is mounted on a substrate. Each chip package can be individually addressed by the substrate, such as to enable the chip therein, using a stair step arrangement of the conductive pads in which the pads on the opposite surfaces of each frame are coupled in offset fashion by vias extending through the frame.