Champlin, MN, United States of America

Harlan L Curtis

USPTO Granted Patents = 12 

Average Co-Inventor Count = 3.0

ph-index = 6

Forward Citations = 126(Granted Patents)


Company Filing History:


Years Active: 2005-2010

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12 patents (USPTO):Explore Patents

Title: Harlan L. Curtis: Innovator in MEMS Device Packaging

Introduction

Harlan L. Curtis is a notable inventor based in Champlin, MN (US), recognized for his contributions to the field of Micro-Electro-Mechanical Systems (MEMS) device packaging. With a total of 12 patents to his name, Curtis has made significant advancements in the methods and systems used to seal MEMS devices, ensuring their reliability and performance.

Latest Patents

Among his latest patents, Curtis has developed a "System and method for sealing a MEMS device." This innovative method involves assembling a hermetically sealed package to contain a MEMS die. The process includes selectively applying a glass mixture to a dome, heating it to a temperature that allows the glass to flow, and then pressing the dome into contact with a carrier containing the MEMS device. The dome is cooled while maintaining contact, allowing the glass mixture to harden into a glass frit, effectively sealing the carrier to the dome. Another significant patent is related to "MEMS device packaging methods," which outlines a comprehensive approach to packaging a MEMS device. This method includes aligning the MEMS die with a MEMS package, creating a controlled vacuum pressure, and sealing the package to form a hermetically sealed interior chamber while establishing electrical connections.

Career Highlights

Harlan L. Curtis is currently employed at Honeywell International Inc., where he continues to innovate and contribute to the field of MEMS technology. His work has been instrumental in enhancing the reliability and efficiency of MEMS devices, which are widely used in various applications, including sensors and actuators.

Collaborations

Curtis has collaborated with notable colleagues such as Jon B. DCamp and Max C. Glenn, contributing to a dynamic work environment that fosters innovation and creativity in MEMS technology.

Conclusion

Harlan L. Curtis stands out as a prominent inventor in the MEMS device packaging industry. His innovative patents and contributions to Honeywell International Inc. reflect his commitment to advancing technology in this critical field.

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