The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
May. 07, 2003
Jon B. Dcamp, Savage, MN (US);
Harlan L. Curtis, Champlin, MN (US);
Lori A. Dunaway, New Hope, MN (US);
Max C. Glenn, Chanhassen, MN (US);
Jon B. DCamp, Savage, MN (US);
Harlan L. Curtis, Champlin, MN (US);
Lori A. Dunaway, New Hope, MN (US);
Max C. Glenn, Chanhassen, MN (US);
Honeywell International Inc., Morristown, NJ (US);
Abstract
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters of contact material onto a bottom surface of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts, and the die to a thermocompression bonding process.