Hsinchu, Taiwan

Hao-Wen Ko

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hao-Wen Ko. Retrieved from https://idiyas.com/inventor/hao-wen-ko-dehin53a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Hao-Wen Ko: Innovator in 3D Integrated Circuit Technology

Introduction

Hao-Wen Ko is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of 3D integrated circuits. His innovative approach has led to advancements that enhance the performance and efficiency of electronic devices.

Latest Patents

Hao-Wen Ko holds a patent for a method related to 3DIC with gap-fill structures. The patent describes a method that includes bonding a top die to a bottom die, depositing a first dielectric liner on the top die, and depositing a gap-fill layer on the first dielectric liner. This gap-fill layer has a first thermal conductivity value that is higher than the second thermal conductivity value of silicon oxide. The method further includes etching the gap-fill layer and the first dielectric liner to form a through-opening, exposing a metal pad in the bottom die. Additionally, it involves depositing a second dielectric liner lining the through-opening, filling the through-opening with a conductive material to form a through-via connecting to the metal pad, and forming a redistribution structure over and electrically connecting to the top die and the through-via.

Career Highlights

Hao-Wen Ko is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in developing advanced manufacturing techniques that are crucial for modern electronics.

Collaborations

Hao-Wen Ko has collaborated with notable colleagues in the field, including Ping-Jung Wu and Ken-Yu Chang. These collaborations have fostered a creative environment that encourages the exchange of ideas and technological advancements.

Conclusion

Hao-Wen Ko's contributions to 3D integrated circuit technology exemplify the spirit of innovation in the semiconductor industry. His patent and ongoing work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a key player in advancing electronic technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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