This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Hao Ting Teo: Innovator in Integrated Circuit Manufacturing
Introduction
Hao Ting Teo is a notable inventor based in Singapore, recognized for his contributions to the field of integrated circuit manufacturing. He holds a patent that showcases innovative techniques for creating inter-layer vias, which are essential for the functionality of modern electronic devices.
Latest Patents
Hao Ting Teo has been granted a patent for "Techniques to manufacture inter-layer vias." This patent describes methods, systems, and devices that enhance the manufacturing process of vias within integrated circuits. The process involves forming a layer of dielectric material over metal lines and creating a cavity through this layer, which exposes the metal lines. The subsequent step includes depositing a conductive material within the cavity to establish electrical connections, thereby improving the efficiency and reliability of integrated circuits. He holds 1 patent in this area.
Career Highlights
Teo is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work focuses on advancing manufacturing techniques that contribute to the development of high-performance electronic components. His expertise in this field has positioned him as a valuable asset to his organization.
Collaborations
Hao Ting Teo has collaborated with notable colleagues, including Keen Wah Chow and Hoong Shing Wong. These partnerships have fostered an environment of innovation and creativity, leading to significant advancements in their projects.
Conclusion
Hao Ting Teo's contributions to integrated circuit manufacturing through his patented techniques demonstrate his commitment to innovation in the technology sector. His work continues to influence the development of efficient electronic components, solidifying his reputation as a skilled inventor.