Company Filing History:
Years Active: 2019
Title: Inventor Profile: Hao-Chun Ting
Introduction
Hao-Chun Ting is a notable inventor based in New Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, specifically focusing on innovative package designs and methods for manufacturing these essential components. His work has garnered attention in the technology and semiconductor industries.
Latest Patents
Hao-Chun Ting holds a patent for "Semiconductor packages and methods of forming the same." This patent details a semiconductor package that comprises a chip, a redistribution circuit structure, and a UBM pattern. The redistribution circuit structure is strategically placed over and electrically connected to the chip, featuring a topmost conductive pattern. The UBM pattern is also integrated into the design, incorporating a set of vias and a pad, where the vias are systematically arranged in an array, establishing electrical connections to both the pad and the topmost conductive pattern.
Career Highlights
Hao-Chun Ting is currently employed at Taiwan Semiconductor Manufacturing Company Limited, one of the leading firms in the semiconductor industry. His role involves designing and developing advanced semiconductor packages that are critical for modern electronic devices. His expertise and innovative approach have positioned him as a valuable asset to his team.
Collaborations
Throughout his career, Hao-Chun Ting has collaborated with several talented professionals, including his coworkers Mao-Yen Chang and Hao-Yi Tsai. These collaborative efforts have fostered a creative environment, leading to the successful development and execution of innovative semiconductor technologies.
Conclusion
Hao-Chun Ting's contributions to semiconductor technology underline the importance of innovation in today's digital world. His groundbreaking patent and collaborative spirit exemplify the role of inventors in advancing technology. As the industry continues to evolve, innovators like Hao-Chun Ting will remain at the forefront of developing solutions that enhance the functionality and efficiency of semiconductor devices.