Taiwan Semiconductor Manufacturing Comp. Ltd.

Hao-Chun Ting

Hao-Yi Tsai

Tin-Hao Kuo

Kuo-Lung Pan

Tzung-Hui Lee

Mao-Yen Chang

Teng-Yuan Lo

Semiconductor package s and methods of forming the same are disclosed. The semiconductor package includes a chip, a redistribution circuit structure and a UBM pattern. The redistribution circuit structure is disposed over and electrically connected to the chip and includes a topmost conductive pattern. The UBM pattern is disposed over and electrically connected to the topmost conductive pattern, wherein the UBM pattern includes a set of vias and a pad on the set of vias, wherein the vias are arranged in an array and electrically connected to the pad and the topmost conductive pattern.

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Taipei, Taiwan

Hao-Chun Ting