Hanqi Yang

Title: Hanqi Yang: Innovator in 3D Integrated Circuit Design

Introduction

Hanqi Yang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of integrated circuit design, particularly in the development of methods and systems for efficiently implementing three-dimensional integrated circuits (3D-IC).

Latest Patents

Hanqi Yang holds a patent for "Methods, systems, and computer program products for efficiently implementing a 3D-IC." This patent discloses an improved approach for efficiently implementing a 3D-IC design with heterogeneous and/or homogeneous dies. The invention identifies a first die design and a second die design in a 3D electronic design, generating a wrapper design for at least a block of circuit component designs in the second die design. This allows for the concurrent implementation of both the first and second die designs based on a generated floorplan.

Career Highlights

Hanqi Yang is currently employed at Cadence Design Systems, Inc., where he continues to innovate in the field of electronic design automation. His work focuses on enhancing the efficiency and effectiveness of integrated circuit designs.

Collaborations

Some of his notable coworkers include Pinhong Chen and Liqun Deng, who collaborate with him on various projects within the company.

Conclusion

Hanqi Yang's contributions to the field of 3D integrated circuit design exemplify the innovative spirit of modern technology. His patent and ongoing work at Cadence Design Systems, Inc. highlight his commitment to advancing electronic design methodologies.