Company Filing History:
Years Active: 2015-2016
Title: **Innovator Spotlight: Hang-Shing Ma**
Introduction
Hang-Shing Ma, based in Portland, Oregon, is a prominent inventor recognized for her groundbreaking work in the field of semiconductor technology. With a remarkable portfolio consisting of three patents, she has made significant contributions to the development of 3D interconnect structures, enhancing the efficiency of electronic devices.
Latest Patents
Hang-Shing Ma's latest patents showcase her innovative approach to semiconductor manufacturing. Her first patent details a "3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach." This invention leverages a unique process flow, integrating through-silicon vias (TSVs) and metal redistribution layers (RDLs), while also incorporating silicon nitride or silicon carbide passivation layers to provide a hermetic barrier and etch stop during manufacturing.
In her second patent, she describes a "3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias." This patent highlights an alternative manufacturing technique that utilizes a single damascene type process flow, further enhancing the integration of metal redistribution layers with TSVs, ensuring device robustness through the use of passivation layers.
Career Highlights
Currently, Hang-Shing Ma works at Intel Corporation, a company renowned for its leadership in semiconductor innovation. Throughout her career, she has demonstrated an unwavering commitment to pushing the boundaries of technology, making her a vital asset to the company and the industry as a whole.
Collaborations
In her innovative journey, Hang-Shing Ma has collaborated with esteemed colleagues, including Kevin J. Lee and Mark T. Bohr. These partnerships have facilitated the exchange of ideas and expertise, accelerating the development of cutting-edge technologies within Intel Corporation.
Conclusion
Hang-Shing Ma exemplifies the spirit of innovation within the semiconductor industry. Through her patents and collaborative efforts, she contributes to significant advancements, paving the way for the future of electronics. Her work not only enhances device performance but also establishes her as a leading inventor in her field.