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Portland, OR, United States of America

Hang-Shing Ma

Average Co-Inventor Count = 7.00

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 29

Hang-Shing MaMark T Bohr (3 patents)Hang-Shing MaKevin J Lee (3 patents)Hang-Shing MaAndrew W Yeoh (3 patents)Hang-Shing MaChristopher M Pelto (3 patents)Hang-Shing MaHiten Kothari (3 patents)Hang-Shing MaSeshu V Sattiraju (3 patents)Hang-Shing MaHang-Shing Ma (3 patents)Mark T BohrMark T Bohr (164 patents)Kevin J LeeKevin J Lee (44 patents)Andrew W YeohAndrew W Yeoh (30 patents)Christopher M PeltoChristopher M Pelto (16 patents)Hiten KothariHiten Kothari (10 patents)Seshu V SattirajuSeshu V Sattiraju (4 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Intel Corporation (3 from 54,750 patents)


3 patents:

1. 9530740 - 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach

2. 9449913 - 3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias

3. 9142510 - 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach

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as of
12/25/2025
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