Hang Lim Lee

Title: Innovations of Hang Lim Lee

Introduction

Hang Lim Lee is a notable inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of die bonding technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and effectiveness of die surface treatment and bonding systems.

Latest Patents

One of his latest patents is the "Die surface treatment apparatus and die bonding system including the same." This invention provides a die surface treatment apparatus capable of sequentially performing reduction and activation processes on dies in a dual zone. The apparatus includes a stage supporting dies, a first plasma generator that performs a reduction process on the surfaces of the dies in a first plasma area, and a second plasma generator that performs a hydrophilization process in a second plasma area.

Another significant patent is the "Bonding head and die bonding apparatus having the same." This invention features a bonding head that includes a body connected to a driving section for transferring the die. It also has a plate heater mounted to the lower surface of the body and a collet that holds the die using vacuum pressure. The design incorporates a cooling channel to supply and recover cooling fluid, ensuring efficient operation of the plate heater.

Career Highlights

Hang Lim Lee has worked with prominent companies such as Semes Co., Ltd. and Samsung Electronics Co., Ltd. His experience in these organizations has contributed to his expertise in the field of die bonding technology.

Collaborations

He has collaborated with notable coworkers, including Jong Jin Weon and Soon Hyun Kim, who have also contributed to advancements in the industry.

Conclusion

Hang Lim Lee's innovative patents and career achievements highlight his significant role in advancing die bonding technology. His contributions continue to influence the field and pave the way for future innovations.