Semes Co., Ltd.

Samsung Electronics Co., Ltd.

Hang Lim Lee

Ji Hoon Park

Seung Dae Seok

Soon Hyun Kim

Jong Jin Weon

Min Young Kim

The inventive concept provides a bonding method. The bonding method includes bonding a second bonding object to a first bonding object, which is a bonding step; providing a protective agent to a region of the first bonding object which is not bonded to the second bonding object, which is a protective agent providing step; and etching a backside of the second bonding object, which is an etching step.

Method of bonding a semiconductor die to a wafer

There are provided a die surface treatment apparatus capable of sequentially performing reduction and activation processes on dies in a dual zone and a die bonding system including the die surface treatment apparatus. The die surface treatment apparatus includes: a stage supporting dies, a first plasma generator installed on a moving path of the dies, the first plasma generator performing a reduction process on surfaces of the dies, in a first plasma area; and a second plasma generator installed on the moving path of the dies, the second plasma generator performing a hydrophilization process on the surfaces of the dies, in a second plasma area.

Die surface treatment apparatus and die bonding system including the same

A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.

Growing community of inventors

Chungcheongnam-do, South Korea

Hang Lim Lee