The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Sep. 27, 2022
Applicant:
Semes Co., Ltd., Cheonan-si, KR;
Inventor:
Hang Lim Lee, Cheonan-si, KR;
Assignee:
SEMES CO., LTD., Chungcheongnam-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 2224/80004 (2013.01); H01L 2224/80011 (2013.01); H01L 2224/80013 (2013.01); H01L 2224/80031 (2013.01); H01L 2224/80203 (2013.01); H01L 2924/35121 (2013.01);
Abstract
The inventive concept provides a bonding method. The bonding method includes bonding a second bonding object to a first bonding object, which is a bonding step; providing a protective agent to a region of the first bonding object which is not bonded to the second bonding object, which is a protective agent providing step; and etching a backside of the second bonding object, which is an etching step.