The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
Apr. 21, 2022
Applicant:
Semes Co., Ltd., Chungcheongnam-do, KR;
Inventors:
Assignee:
SEMES CO., LTD., Chungcheongnam-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05H 1/24 (2006.01);
U.S. Cl.
CPC ...
H01L 24/74 (2013.01); H05H 1/24 (2013.01); H01L 24/05 (2013.01); H01L 24/80 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/80013 (2013.01); H01L 2224/80395 (2013.01); H05H 2245/40 (2021.05);
Abstract
There are provided a die surface treatment apparatus capable of sequentially performing reduction and activation processes on dies in a dual zone and a die bonding system including the die surface treatment apparatus. The die surface treatment apparatus includes: a stage supporting dies, a first plasma generator installed on a moving path of the dies, the first plasma generator performing a reduction process on surfaces of the dies, in a first plasma area; and a second plasma generator installed on the moving path of the dies, the second plasma generator performing a hydrophilization process on the surfaces of the dies, in a second plasma area.