Hsinchu, Taiwan

Han-Chang Hsieh

This inventor holds 3 USPTO granted patents and 3 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2000-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Han-Chang Hsieh. Retrieved from https://idiyas.com/inventor/han-chang-hsieh-6gemt9vb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2000-2025

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3 patents (USPTO):Explore Patents

Title: Han-Chang Hsieh: Innovator in Semiconductor Technology

Introduction

Han-Chang Hsieh is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the efficiency and functionality of semiconductor devices.

Latest Patents

One of Han-Chang Hsieh's latest patents is titled "Semiconductor device and method of fabricating the same." This invention describes a semiconductor device that includes a semiconductor substrate, an interconnection layer, and an inductor pattern. The interconnection layer is positioned on the semiconductor substrate, and the inductor pattern is electrically connected to it. The design features a first conductive line joined with a first terminal, a second conductive line joined with a second terminal, and multiple conductive coils that connect the two conductive lines. The configuration of these coils is designed to optimize performance by ensuring specific spatial relationships between the components.

Another notable patent is "Deep-submicron integrated circuit package for improving bondability." This method enhances wire interconnect pads on integrated circuit devices. It involves providing a semiconductor substrate with an aluminum-copper top metal layer and a titanium nitride layer. The process includes applying a photoresist coating, partially exposing it, and etching to create an array of submicron-sized holes. This innovative approach results in a rough textured surface profile that significantly improves bondability for integrated circuit devices.

Career Highlights

Han-Chang Hsieh is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing semiconductor fabrication techniques and enhancing device performance.

Collaborations

Han-Chang Hsieh has collaborated with notable colleagues, including Yung-Sheng Huang and Hung-Chang Hsieh. These partnerships have contributed to the development of innovative semiconductor technologies.

Conclusion

Han-Chang Hsieh is a key figure in semiconductor innovation, with a focus on improving device fabrication and performance. His contributions through patents and collaborations continue to shape the future of semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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