Guangzhou, China

Haixiang Deng

USPTO Granted Patents = 11 

Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2023-2025

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11 patents (USPTO):

Title: Haixiang Deng: Innovator in Bonding Technology

Introduction

Haixiang Deng is a prominent inventor based in Guangzhou, China. He has made significant contributions to the field of bonding technology, holding a total of 11 patents. His innovative approaches have enhanced the efficiency and effectiveness of wire bonding machines.

Latest Patents

Deng's latest patents include a cooperative bonding method for a bonding head of a wire bonding machine. This method involves setting an initial height value for the vertical lifting mechanism and controlling the bonding head to perform a positioning operation on the target processing chip. The process ensures that the bonding head rises back without exceeding a residual vibration curve, thereby improving bonding efficiency while minimizing impacts on the chip. Another notable patent is a three-dimensional measurement method, device, and storage medium. This method utilizes a three-step phase shift technique to embed marker line information into a sinusoidal stripe pattern, allowing for precise measurements of objects.

Career Highlights

Deng is affiliated with the Guangdong University of Technology, where he continues to advance research in bonding technologies. His work has been instrumental in developing methods that enhance the performance of wire bonding machines, making them more reliable and efficient.

Collaborations

Deng collaborates with notable colleagues such as Jian Gao and Lanyu Zhang. Their combined expertise contributes to the innovative projects undertaken at the university.

Conclusion

Haixiang Deng's contributions to bonding technology exemplify the impact of innovation in engineering. His patents reflect a commitment to improving manufacturing processes and enhancing the capabilities of wire bonding machines.

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