Hailuo Fu

Title: Hailuo Fu: Innovator in Metallisation Processes

Introduction

Hailuo Fu is a notable inventor based in Westminster, CO (US). He has made significant contributions to the field of metallisation, particularly in the development of processes that enhance the adhesion of metals to non-conductive substrates. His innovative approach has led to advancements that are crucial for various applications in technology and manufacturing.

Latest Patents

Hailuo Fu holds 1 patent for his invention titled "Adhesion Promoting Process for Metallisation of Substrate Surfaces." This method provides a high adhesion of deposited metal to non-conductive substrate materials, forming a durable bond. The process involves applying a metal oxide adhesion promoter that is activated before metal plating. This technique ensures a strong adhesion between the non-conductive substrate and the plated metal layer, which is essential for the longevity and performance of the final product.

Career Highlights

Throughout his career, Hailuo Fu has worked with prominent companies in the industry, including Atotech Deutschland GmbH and Atotech Deutschland GmbH & Co. KG. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in metallisation processes.

Collaborations

Hailuo Fu has collaborated with talented individuals such as Zhiming Liu and Sara Hunegnaw. These partnerships have fostered innovation and have been instrumental in the development of his patented processes.

Conclusion

Hailuo Fu's contributions to the field of metallisation through his innovative patent demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry, paving the way for future innovations in substrate metallisation.