The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Sep. 22, 2014
Applicant:
Atotech Deutschland Gmbh, Berlin, DE;
Inventors:
Zhiming Liu, Englewood, CO (US);
Hailuo Fu, Westminster, CO (US);
Sara Hunegnaw, Denver, CO (US);
Lutz Brandt, Berlin, DE;
Assignee:
Atotech Deutschland GmbH, Berlin, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/02 (2006.01); B05D 7/00 (2006.01); C23C 28/00 (2006.01); C23C 18/16 (2006.01); C25D 5/50 (2006.01); C25D 5/54 (2006.01); C23C 18/12 (2006.01); C23C 18/18 (2006.01); C23C 18/34 (2006.01); C23C 18/40 (2006.01); C03C 17/36 (2006.01); C23C 18/14 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1653 (2013.01); C03C 17/3618 (2013.01); C03C 17/3642 (2013.01); C03C 17/3697 (2013.01); C23C 18/1212 (2013.01); C23C 18/1216 (2013.01); C23C 18/1245 (2013.01); C23C 18/1295 (2013.01); C23C 18/14 (2013.01); C23C 18/165 (2013.01); C23C 18/1639 (2013.01); C23C 18/1642 (2013.01); C23C 18/1651 (2013.01); C23C 18/1667 (2013.01); C23C 18/1692 (2013.01); C23C 18/1694 (2013.01); C23C 18/1879 (2013.01); C23C 18/1893 (2013.01); C23C 18/34 (2013.01); C23C 18/40 (2013.01); C23C 28/322 (2013.01); C23C 28/345 (2013.01); C25D 5/50 (2013.01); C25D 5/54 (2013.01);
Abstract
A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a metal oxide adhesion promoter which is activated and then metal plated. The method provides high adhesion of the non-conductive substrate to the plated metal layer.