Hai Jeong Sohn

Title: Innovations of Hai Jeong Sohn

Introduction

Hai Jeong Sohn is a prominent inventor based in Kyungki-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing memory density and improving manufacturing processes for semiconductor packages.

Latest Patents

Among his latest patents is the "Dual-lead type square semiconductor package and dual in-line memory module using the same." This innovation addresses the limitations of conventional memory modules, which are internationally standardized and restrict memory density improvements. Sohn's design features substantially square semiconductor packages that allow for reduced package length and pin pitch, thereby increasing memory density without altering module size.

Another notable patent is the "Method for manufacturing a chip scale package having copper traces selectively plated with gold." This method involves creating a tape wiring board with specific features that enhance the bond strength between solder balls and pads. By applying a pre-flux or cover sheet over solder ball mounting pads, the formation of intermetallic compounds is prevented, leading to improved reliability in semiconductor packages.

Career Highlights

Hai Jeong Sohn is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing technologies that are critical to modern electronics.

Collaborations

Sohn has collaborated with notable colleagues, including Do Soo Jeong and Young Hee Song, contributing to a dynamic team focused on semiconductor advancements.

Conclusion

Hai Jeong Sohn's contributions to semiconductor technology through his patents reflect his commitment to innovation and excellence in the field. His work not only enhances memory density but also improves manufacturing processes, making a significant impact on the industry.