The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 1998
Filed:
Jun. 28, 1996
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
Lead frames for semiconductor chips include spaced apart tie-bars which extend to contact and support the semiconductor chip. Adhesive is used between the tie-bars and the chip to adhesively couple the tie-bars to the chip. The lead frame leads therefore need not be used to adhesively couple the chip to the lead frame, thereby reducing or eliminating the need for equal spacing and close coupling of the leads, and reducing or preventing problems caused by deterioration of adhesive on the leads. The tie-bars may include polyimide tape or liquid adhesive held in cups. During fabrication, a semiconductor chip is mounted on the adhesive material, such that the tie-bars mechanically support the semiconductor chip and the lead ends extend adjacent the semiconductor chip. The lead ends are then electrically connected to the semiconductor chip and the package is encapsulated.