Location History:
- Suwon, KR (1998 - 2000)
- Kyungki-do, KR (1998 - 2001)
Company Filing History:
Years Active: 1998-2001
Title: **Inventor Profile: Do Soo Jeong**
Introduction
Do Soo Jeong is a prominent inventor located in Kyungki-do, South Korea. With an impressive portfolio of 8 patents, he has significantly contributed to the field of semiconductor packaging technology. His innovative approaches are reshaping the functionality and reliability of electronic devices.
Latest Patents
Among his latest patents, one noteworthy innovation is the "Method for manufacturing a chip scale package having copper traces selectively plated with gold." This method enhances the manufacturing process of chip scale packages by utilizing a unique polyimide tape with integrated copper traces and advanced connection mechanisms. The innovative application of pre-flux or cover sheets serves to prevent gold plating on solder ball mounting pads, thereby improving the bond strength between solder balls and pads.
Another of his significant inventions is the "Semiconductor device package having twice-bent tie bar and small die pad." This package design features a die pad that supports a vertically attached semiconductor chip, effectively minimizing the risk of imperfect encapsulation and potential damage to the die pad. The intricate design of the tie bar, with its downward and upward bends, ensures structural integrity and enhances the durability of the semiconductor package.
Career Highlights
Do Soo Jeong has devoted his career to advancements in semiconductor technology while working at Samsung Electronics Co., Ltd. His contributions have established him as a leading figure in his field, where he continues to focus on developing innovative solutions that address industry challenges.
Collaborations
Throughout his career, Do Soo Jeong has collaborated with esteemed coworkers like Min Cheol An and Hyeon J Jeong. Together, they have worked on various projects, pooling their expertise to drive innovation and improve electronic packaging solutions.
Conclusion
Do Soo Jeong's contributions to the field of semiconductor packaging are invaluable, with a strong focus on enhancing device reliability and functionality. His ongoing work at Samsung Electronics Co., Ltd. not only exemplifies his dedication to innovation but also highlights the importance of collaboration in achieving groundbreaking advancements in technology.