The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2001
Filed:
May. 19, 1998
Do Soo Jeong, Kyungki-do, KR;
Kyung Seob Kim, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A semiconductor device package includes a die pad to which a semiconductor chip is vertically attached, having a smaller horizontal size than a horizontal size of the semiconductor chip. The package includes a plurality of inner leads which are electrically connected to the semiconductor chip, a plurality of outer leads each of which is integral with a respective one of the plurality of inner leads, a tie bar, and a package body for encapsulating the semiconductor chip, the die pad, and the plurality of inner leads. The tie bar for supporting the die pad has a downward bend effecting a downward vertical displacement from the die pad, and has a laterally spaced apart upward bend effecting an upward vertical displacement from the die pad. This package prevents imperfect encapsulation and resulting problems such as cracking of the package, and reduces damage to the die pad, such as warping of the die pad.